COOLSERVER 4U R20 CPU Server Cooler 165W 5 Heatpipes Desktop computer case radiator mute Air cooling fan for Intel LGA2011 2066(rectangular motherboard)

Product model: LGA2011-R20

CPU type: LGA2011 (rectangular motherboard)

Voltage: 12V

Product size: 105mm*92.5mm*125.8mm

Fan speed: PWM 1900-3800RPM

Noise value: 44.00dBA (MAX)

Air volume: 61.46CFM (MAX)

Fan Plug: 4pin PWM

Bearing type: double ball

Number of copper pipes: 5

CPU hole distance: 56mm*94mm

Power consumption: 165W

Material: copper base + aluminum fins + 5 heat pipes

COOLSERVER 4U Heat sink 5 heat pipe Durable bearing ball temperature control fan

Five composite heat pipes were used

Better heat conduction ability, better excellent heat conduction and heat dissipation performance

Five high efficiency heat pipes closely cover the CPU surface, greatly increasing the contact area, so that the heat is more efficient to the heat dissipation fin.

Nickel plating technology of heat pipe

The design of 5 composite heat pipes, through the surface treatment of nickel plating, increase the contact between magnesium light and anti-oxidation heat pipe, effectively improve heat conduction efficiency of heat pipe

Fan 9225 is used

Imported Ic components, quiet, stable, strong wind, large air volume, fast and efficient heat dissipation

Unique fan blade design can effectively reduce the wind cutting sound generated by the fan blade.

Electroless nickel plating technology for aluminum plate

1. The metal surface treated by this process is amorphous coating with excellent corrosion resistance

2. As the surface of the catalytic treatment is amorphous, that is, in the basic plane state, with self-lubrication, therefore, the friction coefficient is small, non-adhesion is good, high wear resistance

3. After electroless plating, the hardness of metal surface can be increased by more than one time

4. The combination strength of alloy layer and metal base parts increases after electroless plating. Generally, under the condition of 350-400mpa, there is no peeling, no shedding, no bubble, and the combination strength of aluminum can reach 102-241mpa.

Reflow welding process is adopted

Better contact, stable thermal conductivity, high thermal conversion rate, efficient heat dissipation

The heat-conducting copper pipe and the base adopt reflow welding process, high precision and tight joint, full solder, fine workmanship, improve the heat conduction efficiency of CPU to the heat dissipation fin.

Aluminum fin heat dissipation module

Adopt pure aluminum interbody heat dissipation group design, can directly disperse part of the temperature, greatly improve the heat dissipation efficiency

The fins on both sides of the radiator can not only increase firmness, but also keep the same spacing between each fin, so that the air flow can pass through each fin evenly and smoothly, and enhance the heat dissipation performance.

The cooling fin is nickel plated

Using 0.3mm thickness aluminum fin heat dissipation, nickel plating process to increase the appearance and oxidation resistance, multi-layer airflow through the structure design, to reduce airflow loss.

Copper bottom conducts heat rapidly

Zero distance contact of copper bottom is conducive to the heat generated by 21CPU to conduct around the first time

Attach to CPU heating core, absorb and conduct every minute of heat in time